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CSPEMI200A 4 Channel Headset EMI Filter with ESD Protection
Features
* * * * * * * * * * Four channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Includes 1 channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals--ideal for audio applications 11-bump, 2.046mm X 1.436mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available
Product Description
The CSPEMI200A is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI200A provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CSPEMI200A can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI200A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI200A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
Applications
* * * * * * * EMI filtering and ESD protection for audio ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs
Electrical Schematic
MIC_IN1 B1 100 C1 MIC_OUT1 SPKR_IN1 C3 100pF 10 A3 SPKR_OUT1 100pF 47pF 47pF
MIC_IN2
A2
68
C2
MIC_OUT2
SPKR_IN2
C4 100pF
10
A4
SPKR_OUT2
100pF
GND GND
B3 B4
47pF
47pF
B2
ESD Channel
(c) 2005 California Micro Devices Corp. All rights reserved. 09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CSPEMI200A
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW (Bumps Up View)
MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2
1 A B C
2
3
4
C1 C2
ESD1
C3
GND
C4
GND
200A
MIC_IN1
B1 Orientation Marking
B2 A2
B3 A3
B4 A4
MIC_IN2 SPKR_OUT1 SPKR_OUT2
A1
CSPEMI200A
Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN A1 A2 A3 A4 B1 B2 B3 B4 C1 C2 C3 C4 NAME N.B. MIC_IN2 SPKR_OUT1 SPKR_OUT2 MIC_IN1 ESD1 GND GND MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 DESCRIPTION No Bump - used for orientation / alignment Microphone Input 2 (from microphone) Speaker Output 1 (to speaker) Speaker Output 2 (to speaker) Microphone Input 1 (from microphone) ESD Protection Input. Provides a channel specifically for ESD protection purposes. Device Ground Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Bumps 11 Package CSP Ordering Part Number1 CSPEMI200A Part Marking 200A Lead-free Finish2 Ordering Part Number1 CSPEMI200AG Part Marking 200A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/27/05
CSPEMI200A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 400 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL R1 R2 R3 C1 C2 ILEAK VSIG PARAMETER Resistance 1 Resistance 2 Resistance 3 Capacitance 1 Capacitance 2 Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 Cut-off frequency 3; Note 6 VIN=5.0V ILOAD = 10mA 5 -5 15 8 Notes 2,3,4 and 5 +15 -19 R = 100, C = 47pF R = 68, C = 47pF R = 10, C = 100pF 53 61 33 V V MHz MHz MHz 7 -10 CONDITIONS MIN 90 61 9 38 80 TYP 100 68 10 47 100 MAX 110 75 11 57 120 1.0 15 -15 UNITS pF pF A V V kV kV
VESD
Notes 2,4 and 5
VCL
fC1 fC2 fC3
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization. Note 6: ZSOURCE=50, ZLOAD=50.
(c) 2005 California Micro Devices Corp. All rights reserved. 09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CSPEMI200A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/27/05
CSPEMI200A
Performance Information (Cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
(c) 2005 California Micro Devices Corp. All rights reserved. 09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CSPEMI200A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 6. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved.
Figure 7. Lead-free (SnAgCu) Solder Ball Reflow Profile
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/27/05
CSPEMI200A
Mechanical Details
CSP Mechanical Specifications CSPEMI200A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 B2
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 11 Inches Nom Max
C B A 1 2 3 4 D1 D2 A2 C2
2.001 2.046 2.091 0.0788 0.0806 0.0823 1.391 1.436 1.481 0.0548 0.0565 0.0583 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.223 0.273 0.323 0.0088 0.0107 0.0127 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.562 0.606 0.650 0.0221 0.0239 0.0256 0.356 0.381 0.406 0.0140 0.0150 0.0160 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI200A Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.29 X 1.60 X 0.81 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CSPEMI200A
CHIP SIZE (mm) 2.04 X 1.44 X 0.606
P0 4mm
P1 4mm
Po Top Cover Tape
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 8. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved. 09/27/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
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